3lda: Difference between revisions
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{{STRUCTURE_3lda| PDB=3lda | SCENE= }} | {{STRUCTURE_3lda| PDB=3lda | SCENE= }} | ||
===Yeast Rad51 H352Y Filament Interface Mutant=== | ===Yeast Rad51 H352Y Filament Interface Mutant=== | ||
{{ABSTRACT_PUBMED_20371520}} | |||
==Function== | |||
[[http://www.uniprot.org/uniprot/RAD51_YEAST RAD51_YEAST]] Required both for recombination and for the repair of DNA damage caused by X-rays. Its function may be modulated by interaction with other repair proteins. RAD52 interacts directly with RAD51, via its C-terminus. Forms a nucleoprotein filament with DNA as an early intermediate in recombination.<ref>PMID:16818607</ref> | |||
==About this Structure== | ==About this Structure== | ||
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==Reference== | ==Reference== | ||
<ref group="xtra">PMID: | <ref group="xtra">PMID:020371520</ref><references group="xtra"/><references/> | ||
[[Category: Saccharomyces cerevisiae]] | [[Category: Saccharomyces cerevisiae]] | ||
[[Category: Chen, J.]] | [[Category: Chen, J.]] | ||
Revision as of 20:30, 4 April 2013
Yeast Rad51 H352Y Filament Interface Mutant
Template:ABSTRACT PUBMED 20371520
Function
[RAD51_YEAST] Required both for recombination and for the repair of DNA damage caused by X-rays. Its function may be modulated by interaction with other repair proteins. RAD52 interacts directly with RAD51, via its C-terminus. Forms a nucleoprotein filament with DNA as an early intermediate in recombination.[1]
About this Structure
3lda is a 1 chain structure with sequence from Saccharomyces cerevisiae. Full crystallographic information is available from OCA.
Reference
- Chen J, Villanueva N, Rould MA, Morrical SW. Insights into the mechanism of Rad51 recombinase from the structure and properties of a filament interface mutant. Nucleic Acids Res. 2010 Aug;38(14):4889-906. Epub 2010 Apr 5. PMID:20371520 doi:10.1093/nar/gkq209
- ↑ Tsubouchi H, Roeder GS. Budding yeast Hed1 down-regulates the mitotic recombination machinery when meiotic recombination is impaired. Genes Dev. 2006 Jul 1;20(13):1766-75. PMID:16818607 doi:20/13/1766